TSMC has started manufacturing Snapdragon 875 processors on the 5nm process

The Snapdragon 875 will be Qualcomm’s next flagship processor, which will be used in flagship smartphones of 2021. According to the latest report, TSMC has started manufacturing the Snapdragon 875 chip for Qualcomm. Along with that is the Snapdragon X60 5G modem chip, which is expected to be used in the iPhone 12.

According to previous leaked information, Snapdragon 875 will be manufactured on TSMC’s 5nm process. Which means that the performance and power savings will be significantly improved compared to the Snapdragon 865, based on the 7nm process.

The Snapdragon 875 will also include a Snapdragon X60 5G modem chip inside. Other than Snapdragon 865 is separate modem chip. TSMC has also begun manufacturing 5G X60 5G modem chips, not only for integration within the Snapdragon 875, but also for Apple to use in the upcoming iPhone 12.

The Snapdragon 875 processor will include a Cortex-X1 super performance core, 30% stronger than the Cortex-A77 in Snapdragon 865. Besides, there are 3 high-performance Cortex-A78 cores, 20% stronger than Cortex-A77. And 8 energy-efficient Kryo 685 cores. Adreno 660 GPU.

The Snapdragon 855 was once more expensive than the Snapdragon 845, and the Snapdragon 865 is even more expensive. That’s why some smartphone makers decided not to use the Snapdragon 865 chip on their high-end devices anymore, Google Pixel 5 is an example. However, the integration of a modem chip inside the Snapdragon 875 processor can help reduce costs.

References: phonearena