- Tram Ho
Recently, a source from SamMobile said that the next generation of Galaxy Z Fold3 besides notable upgrades in screen or the ability to support S Pen, this machine also brings a (several) points worth noting. disappointed.
Specifically, as previous information has confirmed, Galaxy Z Fold3 will only be equipped with Snapdragon 888 chip, not the latest and most powerful chip of Qualcomm at the moment (there is an upgraded version). Snapdragon 888+). Snapdragon 888 is a chip that causes a lot of overheating on many high-end smartphones at the moment, and this is the first disappointment of the Galaxy Z Fold3.
The second disappointing point comes from the selfie camera technology hidden under the screen (UPC). It is known that the Galaxy Z Fold3 will be the first Samsung smartphone to apply this technology. However, according to a leaked source, the Galaxy Z Fold3’s UPC selfie camera sensor will only have a resolution of 4MP, too low for a super high-end smartphone. In addition, well-known leaker in the technology world, Max Weinbach, also confirmed that the camera hidden under the screen of the Z Fold3 will only give the same quality as the ZTE Axon 20 5G. ZTE Axon 20 5G along with Vsmart Aris Pro and Rakuten BIG are the first three smartphones in the world equipped with a selfie camera hidden under the screen, using the same “InV see” solution provided by Visionox.
Of course, in addition to the above disappointing points, the Galaxy Z Fold3 will also bring many new upgrades, promising to be superior to its predecessor, such as an upgraded screen with higher frequency. 120Hz scanning on both main and secondary screens, support for S Pen, support for IPX8 water resistance and is expected to have a cheaper price.
Galaxy Z Fold3 will be introduced by Samsung with a series of other product lines at the Galaxy Unpacked event held on August 11 here.
Source : Genk