TSMC will soon hit a new breakthrough with its 2nm chip manufacturing process by 2024

Tram Ho

TSMC will soon make new strides in developing 2nm architecture for chips in the near future.

TSMC sẽ sớm đạt bước đột phá mới với quy trình sản xuất chip 2nm vào năm 2024 - Ảnh 1.

Page PatentlyApple citing sources from the supply chain revealed, TSMC’s upcoming 2nm process will apply multi-channel field-effect transistor architecture (MBCFET).

This architecture differs from the finned field transistor architecture (FinFET) currently used to make 3nm and 5nm chips. In addition, the 2nm chip uses a new process, helping to address FinFET’s current limitations.

This will be a big step forward for TSMC against competitors, especially Samsung.

TSMC is optimistic that, test productivity by the end of 2023 will reach 90% and this is an important condition to attract orders from Apple in the future. The Taiwanese semiconductor company also plans to start mass production of 2nm chips by 2024.

TSMC sẽ sớm đạt bước đột phá mới với quy trình sản xuất chip 2nm vào năm 2024 - Ảnh 2.

It is known that TSMC’s 2nm chip manufacturing process has begun in 2019. Issues that TSMC must take into account when developing 2nm processes are cost, device compatibility and chip performance in the conditions of use are different.

That is not all, however, as TSMC is definitely continuing to work on further processes, possibly even as far as 1nm in the near future. TSMC recently expanded its factory in Taiwan to cater for the 2nm process.

See Gizmochina

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Source : Genk