TSMC announced a new roadmap, confirming plans to build a new 2nm chip production line

Earlier this week, the Taiwanese semiconductor company TSMC announced a new roadmap over the next two years at its annual meeting. Also at the event, the world’s largest contract manufacturer shared some important information such as a plan to build a new 2nm chip foundry.

Specifically, TSMC has started researching 2nm chip molding process and is building a new factory and R&D center. The company plans to recruit about 8,000 employees to serve the development and commercialization of 2nm chips in the market by the end of 2022.

Notably, TSMC’s vice president, YP Chin, confirmed that TSMC has purchased a plot of land in Hsinchu, Taiwan to expand its R&D center.

The 2nm process will be developed based on GAA technology instead of the FInFET solution being used for TSMC’s 3nm fab. This is also a new generation technology that promises to be widely applied in the semiconductor industry in the near future.

Similarly, Samsung has announced plans to use GAA for its 3nm process by 2022. Having more competitors sharing the same technology will surely help the race in the semiconductor market more exciting, special. It will help promote innovation and keep chip and smartphone prices at a reasonable level.

TSMC’s 5nm process is currently being sought after by a series of companies such as Apple, Qualcomm, AMD, …

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