Snapdragon 875 in 2021 will be produced by TSMC on a 5nm process, each square millimeter has 171 million transistors

The Snapdragon 865 is expected to be the next high-end chip designed by Qualcomm for high-end handsets launched in 2020. Although Qualcomm designs chips, it does not own the facilities to manufacture them. Over the past two years, Qualcomm has been cooperating with the world’s largest chip manufacturing company – Semiconductor Manufacturing Company (TSMC) – to produce Snapdragon 845 and 855 chipsets. Previously, Samsung produced Snapdragon 820 and 835. .

Qualcomm will cooperate with TSMC to produce Snapdragon 875 chip in 2021

According to the latest information from Sina.com, Qualcomm is cooperating again with Samsung to produce 865 Snapdragon chips. The Korean tech giant will produce chips with its 7nm EUV process. The 7nm number relates to the number of transistors attached to the chip. The lower the number, the higher the number of transistors that can be installed inside the chip; The more transistors, the stronger the chip and the more energy-efficient.

According to Moore’s Law – Gordon Moore, who co-founded Intel in 1965 – the number of transistors in integrated circuits (such as chips) doubles every year. To show you how far we have gone, the Texas Instruments OMAP 3430 chip used for Motorola DROID 2009 has been built using the 65nm process!

The EUV part of EUV 7nm stands for ultraviolet etching. This is a technology that uses ultraviolet beams to more accurately determine the position of transistors that will be placed inside a chip. The technology is expected to help the Snapdragon 865 save up to 50% on energy consumption compared to its predecessor.

The Snapdragon 865 Mobile Platform is likely to debut on Samsung Galaxy S11 (this event is expected to take place around February 24 before MWC 2020). This chip was recently discovered on the Geekbench benchmark site with a multi-core test score of 12,496, much higher than the 10,946 points of the Snapdragon 855+ – an improved version of the Snapdragon 855.

The 2020 Snapdragon 865 will be produced by Samsung and according to Sina, it will have 2 different versions with code name Kona and Huracan. Both will support LPDDX5 memory chips (RAM) and UFS 3.0 flash memory. However, one of them will be integrated with 5G modem chip and the other will not.

Last week, Huawei released a promotional trailer for Kirin 990 SoC that will be released on September 6th. The chip is expected to be used inside the Mate 30 smartphone and will be integrated with a 5G modem (instead because of using a separate component) to help improve battery life on devices using chipsets.

Sina.com said, for the Snapdragon 875 Mobile Platform of 2021, Qualcomm will once again assign production tasks to TSMC partner. The Snapdragon 875 chipset will be produced under TSMC’s 5nm process. If this information is correct, the new chip will have 171.3 million transistors per millimeter. Therefore, it will certainly be stronger and more energy-efficient than its predecessor chip.

So Moore’s law will continue to take effect? Last year, Samsung unveiled a roadmap that led to 3nm process chip manufacturing by 2022 and TSMC is also looking to do the same with stacking transistors vertically instead of side by side.

Reference: PhoneArena